Inventor

CHIEN CHIN-HER

TW25 patents

⚠️ This page may combine multiple inventors who share the name “CHIEN CHIN-HER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIEN CHIN-HER

TAIWAN SEMICONDUCTOR MFG CO LTD

Layout design methodology for stacked devices

Package structure and method for forming the same

Layout design methodology for stacked devices

Heat dissipation structure including stacked chips surrounded by thermal interface material rings

Integrated antenna on interposer substrate

Through-silicon via in integrated circuit packaging

Heat dissipation structures for three-dimensional system on integrated chip structure

Layout design methodology for stacked devices

Heat dissipation structures

Integrated antenna on interposer substrate

Through-silicon vias in integrated circuit packaging

Integrated antenna on interposer substrate

Through-silicon vias in integrated circuit packaging

Through silicon via optimization for three-dimensional integrated circuits

Photonic semiconductor device and method

SOIC chip architecture

Integrated antenna on interposer substrate

Integrated antenna on interposer substrate

Interposer with capacitors

Monolithic stacked integrated circuits with a redundant layer for repairing defects

Integrated circuit comprising buffer chain

Oxide definition (OD) gradient reduced semiconductor device

TAIWAN SEMICONDUCTOR MFG

Repairing monolithic stacked integrated circuits with a redundant layer and lithography process

Integrated circuit comprising buffer chain

Oxide definition (OD) gradient reduced semiconductor device and method of making