Inventor
WISWESSER ANDREAS NORBERT
DE26 patents
Patents
26 patentsUS6190234B1Feb 20, 2001
Endpoint detection with light beams of different wavelengths
APPLIED MATERIALS INC309 citations99
US7018271B2Mar 28, 2006
Method for monitoring a substrate during chemical mechanical polishing
APPLIED MATERIALS INC127 citations98
US6296548B1Oct 2, 2001
Method and apparatus for optical monitoring in chemical mechanical polishing
APPLIED MATERIALS INC132 citations98
US6280289B1Aug 28, 2001
Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
APPLIED MATERIALS INC187 citations98
US6247998B1Jun 19, 2001
Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC124 citations98
US6159073ADec 12, 2000
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC233 citations98
US6524165B1Feb 25, 2003
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC39 citations96
US6652355B2Nov 25, 2003
Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
APPLIED MATERIALS INC44 citations95
US7008295B2Mar 7, 2006
Substrate monitoring during chemical mechanical polishing
APPLIED MATERIALS INC43 citations93
US6811466B1Nov 2, 2004
System and method for in-line metal profile measurement
APPLIED MATERIALS INC21 citations93
US6716085B2Apr 6, 2004
Polishing pad with transparent window
APPLIED MATERIALS INC39 citations93
US7086929B2Aug 8, 2006
Endpoint detection with multiple light beams
APPLIED MATERIALS INC21 citations92
US6994607B2Feb 7, 2006
Polishing pad with window
APPLIED MATERIALS INC31 citations92
US6832950B2Dec 21, 2004
Polishing pad with window
APPLIED MATERIALS INC26 citations92
US6632124B2Oct 14, 2003
Optical monitoring in a two-step chemical mechanical polishing process
APPLIED MATERIALS INC17 citations92
US6607422B1Aug 19, 2003
Endpoint detection with light beams of different wavelengths
APPLIED MATERIALS INC30 citations92
US6506097B1Jan 14, 2003
Optical monitoring in a two-step chemical mechanical polishing process
APPLIED MATERIALS INC36 citations92
US7264536B2Sep 4, 2007
Polishing pad with window
APPLIED MATERIALS INC25 citations90
US6494766B1Dec 17, 2002
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC17 citations89
US7198544B2Apr 3, 2007
Polishing pad with window
APPLIED MATERIALS INC10 citations84
US7547243B2Jun 16, 2009
Method of making and apparatus having polishing pad with window
APPLIED MATERIALS INC15 citations82
US6764380B2Jul 20, 2004
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC11 citations82
US6986699B2Jan 17, 2006
Method and apparatus for determining polishing endpoint with multiple light sources
APPLIED MATERIALS INC7 citations73
US6913511B2Jul 5, 2005
Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
APPLIED MATERIALS INC9 citations73
US6659842B2Dec 9, 2003
Method and apparatus for optical monitoring in chemical mechanical polishing
APPLIED MATERIALS INC10 citations70
US7101254B2Sep 5, 2006
System and method for in-line metal profile measurement
APPLIED MATERIALS INC5 citations63