Inventor
SWEDEK BOGUSLAW
US21 patents
Patents
21 patentsUS6190234B1Feb 20, 2001
Endpoint detection with light beams of different wavelengths
APPLIED MATERIALS INC309 citations99
US7018271B2Mar 28, 2006
Method for monitoring a substrate during chemical mechanical polishing
APPLIED MATERIALS INC127 citations98
US6399501B2Jun 4, 2002
Method and apparatus for detecting polishing endpoint with optical monitoring
APPLIED MATERIALS INC93 citations98
US6296548B1Oct 2, 2001
Method and apparatus for optical monitoring in chemical mechanical polishing
APPLIED MATERIALS INC132 citations98
US6280289B1Aug 28, 2001
Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
APPLIED MATERIALS INC187 citations98
US6247998B1Jun 19, 2001
Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC124 citations98
US6159073ADec 12, 2000
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC233 citations98
US6975107B2Dec 13, 2005
Eddy current sensing of metal removal for chemical mechanical polishing
APPLIED MATERIALS INC35 citations96
US6924641B1Aug 2, 2005
Method and apparatus for monitoring a metal layer during chemical mechanical polishing
APPLIED MATERIALS INC63 citations96
US6524165B1Feb 25, 2003
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC39 citations96
US6383058B1May 7, 2002
Adaptive endpoint detection for chemical mechanical polishing
APPLIED MATERIALS INC63 citations96
US6652355B2Nov 25, 2003
Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
APPLIED MATERIALS INC44 citations95
US7229340B2Jun 12, 2007
Monitoring a metal layer during chemical mechanical polishing
APPLIED MATERIALS INC15 citations93
US7001246B2Feb 21, 2006
Method and apparatus for monitoring a metal layer during chemical mechanical polishing
APPLIED MATERIALS INC20 citations93
US6657726B1Dec 2, 2003
In situ measurement of slurry distribution
APPLIED MATERIALS INC20 citations92
US6607422B1Aug 19, 2003
Endpoint detection with light beams of different wavelengths
APPLIED MATERIALS INC30 citations92
US6494766B1Dec 17, 2002
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC17 citations89
US6764380B2Jul 20, 2004
Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
APPLIED MATERIALS INC11 citations82
US6930478B2Aug 16, 2005
Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal
APPLIED MATERIALS INC7 citations74
US6986699B2Jan 17, 2006
Method and apparatus for determining polishing endpoint with multiple light sources
APPLIED MATERIALS INC7 citations73
US6913511B2Jul 5, 2005
Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
APPLIED MATERIALS INC9 citations73