Inventor

PÜSCHNER FRANK

DE3 patents

Patents

3 patents

US12588150B2Mar 24, 2026

Package, method for forming a package, chip card, and method for forming a chip card

INFINEON TECHNOLOGIES AG0 citations57

US12499343B2Dec 16, 2025

Wafer-level package sensor device

INFINEON TECHNOLOGIES AG0 citations56

US9324642B2Apr 26, 2016

Method of electrically isolating shared leads of a lead frame strip

INFINEON TECHNOLOGIES AG2 citations53