Inventor

ALCOE DAVID J

US24 patents

⚠️ This page may combine multiple inventors who share the name “ALCOE DAVID J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALCOE DAVID J

IBM

Thermally enhanced lid for multichip modules

Method of reforming reformable members of an electronic package and the resultant electronic package

Module with adhesively attached heat sink

Electronic package with thermally conductive standoff

Thermally enhanced lid for multichip modules

Electronic package having a thermal stretching layer

Hyperbga buildup laminate

Stress-relieving heatsink structure and method of attachment to an electronic package

Compliant laminate connector

Integrated circuit structure

Stress reducing stiffener ring

Method of reforming reformable members of an electronic package and the resultant electronic package

Stress-relieving heatsink structure and method of attachment to an electronic package

Electrical connector system with member having layers of different durometer elastomeric materials

Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections

Apparatus to reduce thermal fatigue stress on flip chip solder connections

Module with adhesively attached heat sink

Integrated circuit structure

Method of reforming reformable members of an electronic package and the resultant electronic package

Hyperbga buildup laminate

Electronic package with optimized circuitization pattern

ENDICOTT INTERCONNECT TECH INC

Adjustable thickness thermal interposer and electronic package utilizing same

Flexible circuit electronic package with standoffs

High density connector for interconnecting fine pitch circuit packaging structures