Inventor
SATHE SANJEEV BALWANT
US16 patents
⚠️ This page may combine multiple inventors who share the name “SATHE SANJEEV BALWANT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS6037658AMar 14, 2000
Electronic package with heat transfer means
IBM88 citations96
US6627998B1Sep 30, 2003
Wafer scale thin film package
IBM58 citations95
US5863814AJan 26, 1999
Electronic package with compressible heatsink structure
IBM37 citations95
US5786635AJul 28, 1998
Electronic package with compressible heatsink structure
IBM54 citations95
US6631078B2Oct 7, 2003
Electronic package with thermally conductive standoff
IBM62 citations94
US6255136B1Jul 3, 2001
Method of making electronic package with compressible heatsink structure
IBM20 citations92
US6245186B1Jun 12, 2001
Electronic package with compressible heatsink structure
IBM33 citations92
US5754400AMay 19, 1998
Demountable heat sink
IBM34 citations92
US5673177ASep 30, 1997
Heat sink structure with corrugated wound wire heat conductive elements
IBM27 citations92
US5654876AAug 5, 1997
Demountable heat sink
IBM20 citations92
US5912800AJun 15, 1999
Electronic packages and method to enhance the passive thermal management of electronic packages
IBM32 citations91
US6747331B2Jun 8, 2004
Method and packaging structure for optimizing warpage of flip chip organic packages
IBM13 citations83
US6058015AMay 2, 2000
Electronic packages and a method to improve thermal performance of electronic packages
IBM13 citations72
US7026706B2Apr 11, 2006
Method and packaging structure for optimizing warpage of flip chip organic packages
IBM3 citations62
US7348261B2Mar 25, 2008
Wafer scale thin film package
IBM3 citations61