Inventor
BOMBONATI MAURO
IT4 patents
Patents
4 patentsUS6504253B2Jan 7, 2003
Structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material composite structure using electric connection structure
ST MICROELECTRONICS SRL53 citations92
US6498053B2Dec 24, 2002
Process of manufacturing a composite structure for electrically connecting a first body of semiconductor material overlaid by a second body of semiconductor material
ST MICROELECTRONICS SRL21 citations89
US6689627B2Feb 10, 2004
Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness
ST MICROELECTRONICS SRL37 citations87
US7595223B2Sep 29, 2009
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
ST MICROELECTRONICS SRL1 citations47