Inventor
SEMAN ANDREW MICHAEL
US8 patents
Patents
8 patentsUS6902869B2Jun 7, 2005
Manufacturing methods for printed circuit boards
IBM156 citations97
US6222136B1Apr 24, 2001
Printed circuit board with continuous connective bumps
IBM131 citations97
US6684497B2Feb 3, 2004
Manufacturing methods for printed circuit boards
IBM16 citations91
US5920037AJul 6, 1999
Conductive bonding design for metal backed circuits
IBM10 citations72
US7240430B2Jul 10, 2007
Manufacturing methods for printed circuit boards
IBM2 citations61
US6178630B1Jan 30, 2001
Conductive bonding design and method for aluminum backed circuits
IBM2 citations61
US7063756B2Jun 20, 2006
Enhanced design and process for a conductive adhesive
IBM2 citations57
US6534724B1Mar 18, 2003
Enhanced design and process for a conductive adhesive
IBM0 citations47