Inventor
CROCKER MICHAEL T
US49 patents
⚠️ This page may combine multiple inventors who share the name “CROCKER MICHAEL T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
42 patentsUS10474460B2Nov 12, 2019
Technologies for optical communication in rack clusters
INTEL CORP15 citations98
US10356495B2Jul 16, 2019
Technologies for cooling rack mounted sleds
INTEL CORP16 citations98
US10348327B2Jul 9, 2019
Technologies for providing power to a rack
INTEL CORP14 citations98
US10349152B2Jul 9, 2019
Robotically serviceable computing rack and sleds
INTEL CORP17 citations98
US10085358B2Sep 25, 2018
Technologies for sled architecture
INTEL CORP26 citations98
US10070207B2Sep 4, 2018
Technologies for optical communication in rack clusters
INTEL CORP19 citations98
US6671172B2Dec 30, 2003
Electronic assemblies with high capacity curved fin heat sinks
INTEL CORP115 citations98
US7124811B2Oct 24, 2006
Systems for integrated pump and cold plate
INTEL CORP69 citations97
US9936613B2Apr 3, 2018
Technologies for rack architecture
INTEL CORP16 citations96
US6657862B2Dec 2, 2003
Radial folded fin heat sinks and methods of making and using same
INTEL CORP65 citations95
US11349734B2May 31, 2022
Robotically serviceable computing rack and sleds
INTEL CORP3 citations93
US10788630B2Sep 29, 2020
Technologies for blind mating for sled-rack connections
INTEL CORP3 citations93
US6902377B2Jun 7, 2005
High performance axial fan
INTEL CORP21 citations93
US7911790B2Mar 22, 2011
Electronic assemblies with high capacity curved and bent fin heat sinks and associated methods
INTEL CORP18 citations92
US7490479B2Feb 17, 2009
Method and system of advanced fan speed control
INTEL CORP14 citations92
US7273090B2Sep 25, 2007
Systems for integrated cold plate and heat spreader
INTEL CORP35 citations92
US7262967B2Aug 28, 2007
Systems for low cost coaxial liquid cooling
INTEL CORP22 citations92
US7200934B2Apr 10, 2007
Electronic assemblies with high capacity heat sinks and methods of manufacture
INTEL CORP27 citations92
US7120020B2Oct 10, 2006
Electronic assemblies with high capacity bent fin heat sinks
INTEL CORP27 citations92
US6101093AAug 8, 2000
Wrap around clip for an electronic cartridge
INTEL CORP21 citations92
US6101096AAug 8, 2000
Heat sink clip for an electronic assembly
INTEL CORP40 citations92
US11200104B2Dec 14, 2021
Technolgies for millimeter wave rack interconnects
INTEL CORP2 citations84
US10985587B2Apr 20, 2021
Battery charge termination voltage adjustment
INTEL CORP12 citations84
US7418998B2Sep 2, 2008
Chamber sealing valve
INTEL CORP9 citations84
US7143820B2Dec 5, 2006
Systems for improved heat exchanger
INTEL CORP15 citations84
US7543457B2Jun 9, 2009
Systems for integrated pump and reservoir
INTEL CORP14 citations83
US7117931B2Oct 10, 2006
Systems for low cost liquid cooling
INTEL CORP10 citations74
US6524116B2Feb 25, 2003
Interlocking socket base for an integrated circuit package
INTEL CORP5 citations74
US6264478B1Jul 24, 2001
Interlocking socket base for an integrated circuit package
INTEL CORP8 citations74
US11233712B2Jan 25, 2022
Technologies for data center multi-zone cabling
INTEL CORP0 citations73
US10910746B2Feb 2, 2021
Memory and power mezzanine connectors
INTEL CORP2 citations73
US7400503B2Jul 15, 2008
Systems for low cost coaxial liquid cooling
INTEL CORP6 citations73
US9823702B2Nov 21, 2017
Electronic device having a detachable tablet
INTEL CORP6 citations67
US10674238B2Jun 2, 2020
Thermally efficient compute resource apparatuses and methods
INTEL CORP0 citations63
US7430119B2Sep 30, 2008
Impeller and aligned cold plate
INTEL CORP5 citations62
US11728665B2Aug 15, 2023
Battery charge termination voltage adjustment
INTEL CORP0 citations61
US12490410B2Dec 2, 2025
Circuit devices integrated with boiling enhancement for two-phase immersion cooling
INTEL CORP1 citations59
US12219706B2Feb 4, 2025
Removable and low insertion force connector system
INTEL CORP0 citations59
US12556496B2Feb 17, 2026
Wormhole backplane ultrahigh density optical routing system
INTEL CORP0 citations57
US7836748B2Nov 23, 2010
Chamber sealing valve
INTEL CORP1 citations52
US9288933B2Mar 15, 2016
Metal injection molded heat dissipation device
INTEL CORP0 citations51
US12082370B2Sep 3, 2024
System device aggregation in a liquid cooling environment
INTEL CORP0 citations49
STANLEY GAVIN D
4 patentsUS8259451B2Sep 4, 2012
Metal injection molded heat dissipation device
STANLEY GAVIN D6 citations82
US8517675B2Aug 27, 2013
Blower fan for low profile environment
STANLEY GAVIN D3 citations61
US8202045B2Jun 19, 2012
Blower fan for low profile environment
STANLEY GAVIN D2 citations61
US8889489B2Nov 18, 2014
Metal injection molded heat dissipation device
STANLEY GAVIN D0 citations50