Inventor

PARK JONGVIN

KR4 patents

⚠️ This page may combine multiple inventors who share the name “PARK JONGVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US8004093B2Aug 23, 2011

Integrated circuit package stacking system

STATS CHIPPAC LTD37 citations91

US7683469B2Mar 23, 2010

Package-on-package system with heat spreader

STATS CHIPPAC LTD32 citations91

LEE SINJAE

1 patent

US8569870B1Oct 29, 2013

Integrated circuit packaging system with shielding spacer and method of manufacture thereof

LEE SINJAE3 citations59

KIM JINGWAN

1 patent

US8310038B2Nov 13, 2012

Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof

KIM JINGWAN2 citations59