Inventor

LIU HSIEN-TSUNG

TW5 patents

⚠️ This page may combine multiple inventors who share the name “LIU HSIEN-TSUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

3 patents

US5180689AJan 19, 1993

Tapered opening sidewall with multi-step etching process

TAIWAN SEMICONDUCTOR MFG62 citations94

US6583039B2Jun 24, 2003

Method of forming a bump on a copper pad

TAIWAN SEMICONDUCTOR MFG37 citations92

US6083790AJul 4, 2000

Method for making y-shaped multi-fin stacked capacitors for dynamic random access memory cells

TAIWAN SEMICONDUCTOR MFG15 citations72

MEGIC CORP

1 patent

US6802945B2Oct 12, 2004

Method of metal sputtering for integrated circuit metal routing

MEGIC CORP10 citations72

LIU HSIEN-TSUNG

1 patent

US8723322B2May 13, 2014

Method of metal sputtering for integrated circuit metal routing

LIU HSIEN-TSUNG0 citations44