Inventor

LIN CHING-SAN

TW11 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHING-SAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MEGICA CORP

3 patents

US8004092B2Aug 23, 2011

Semiconductor chip with post-passivation scheme formed over passivation layer

MEGICA CORP42 citations96

US7397121B2Jul 8, 2008

Semiconductor chip with post-passivation scheme formed over passivation layer

MEGICA CORP49 citations96

US7547969B2Jun 16, 2009

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

MEGICA CORP22 citations92

GTE SYLVANIA INC

2 patents

US4004891AJan 25, 1977

Superalloys containing nitrides and process for producing same

GTE SYLVANIA INC6 citations60

US3989559ANov 2, 1976

Superalloys containing nitrides and process for producing same

GTE SYLVANIA INC5 citations60

LIN MOU-SHIUNG

1 patent

US8319354B2Nov 27, 2012

Semiconductor chip with post-passivation scheme formed over passivation layer

LIN MOU-SHIUNG8 citations84

CHOU CHIU-MING

1 patent

US8242601B2Aug 14, 2012

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

CHOU CHIU-MING7 citations83

HSU CHIA-HUNG

1 patent

US8518743B2Aug 27, 2013

Die structure and die connecting method

HSU CHIA-HUNG8 citations77

MEGIC CORP

1 patent

US6802945B2Oct 12, 2004

Method of metal sputtering for integrated circuit metal routing

MEGIC CORP10 citations72

LIU HSIEN-TSUNG

1 patent

US8723322B2May 13, 2014

Method of metal sputtering for integrated circuit metal routing

LIU HSIEN-TSUNG0 citations44

LIN CHING-SAN

1 patent

US8617963B2Dec 31, 2013

Integrated circuit wafer dicing method

LIN CHING-SAN0 citations38