Inventor
MIYASHITA NAOTO
JP40 patents
⚠️ This page may combine multiple inventors who share the name “MIYASHITA NAOTO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
38 patentsUS6167583B1Jan 2, 2001
Double side cleaning apparatus for semiconductor substrate
TOSHIBA KK101 citations98
US5643046AJul 1, 1997
Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer
TOSHIBA KK207 citations98
US5643406AJul 1, 1997
Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
TOSHIBA KK115 citations98
US6933234B2Aug 23, 2005
Method for manufacturing semiconductor device and polishing apparatus
TOSHIBA KK50 citations96
US5605488AFeb 25, 1997
Polishing apparatus of semiconductor wafer
TOSHIBA KK192 citations96
US5922620AJul 13, 1999
Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
TOSHIBA KK51 citations95
US5993639ANov 30, 1999
Method for producing electrolytic ionic water and an apparatus for the same
TOSHIBA KK36 citations93
US5434447AJul 18, 1995
Semiconductor device having a trench for device isolation and method of fabricating the same
TOSHIBA KK30 citations93
US5029554AJul 9, 1991
Semiconductor manufacturing apparatus including a temperature control mechanism
TOSHIBA KK37 citations93
US7351131B2Apr 1, 2008
Method for manufacturing semiconductor device and polishing apparatus
TOSHIBA KK20 citations92
US6468911B1Oct 22, 2002
Method of chemical/mechanical polishing of the surface of semiconductor device
TOSHIBA KK19 citations92
US6354913B1Mar 12, 2002
Abrasive and method for polishing semiconductor substrate
TOSHIBA KK42 citations92
US6241581B1Jun 5, 2001
Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
TOSHIBA KK30 citations92
US6069083AMay 30, 2000
Polishing method, semiconductor device fabrication method, and semiconductor fabrication apparatus
TOSHIBA KK19 citations92
US6007696ADec 28, 1999
Apparatus and method for manufacturing electrolytic ionic water and washing method using electroyltic ionic water
TOSHIBA KK33 citations92
US5968239AOct 19, 1999
Polishing slurry
TOSHIBA KK40 citations92
US5943578AAug 24, 1999
Method of manufacturing a semiconductor device having an element isolating region
TOSHIBA KK25 citations92
US5880032AMar 9, 1999
Method and apparatus for manufacturing a semiconductor device
TOSHIBA KK28 citations92
US5878191AMar 2, 1999
Heat treatment apparatus for semiconductor wafers
TOSHIBA KK22 citations92
US5861054AJan 19, 1999
Polishing slurry
TOSHIBA KK40 citations92
US5589421ADec 31, 1996
Method of manufacturing annealed films
TOSHIBA KK27 citations92
US5346555ASep 13, 1994
Device for thermal treatment and film forming process
TOSHIBA KK32 citations92
US4916086AApr 10, 1990
Method of manufacturing a semiconductor device having rounded trench corners
TOSHIBA KK32 citations92
US7005382B2Feb 28, 2006
Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
TOSHIBA KK30 citations91
US6723226B1Apr 20, 2004
Method and apparatus for forming electrolytic water and apparatus for washing semiconductor substrate using electrolytic water-forming apparatus
TOSHIBA KK33 citations88
US6045605AApr 4, 2000
Abrasive material for polishing a semiconductor wafer, and methods for manufacturing and using the abrasive material
TOSHIBA KK16 citations84
US6001238ADec 14, 1999
Method for purifying pure water and an apparatus for the same
TOSHIBA KK18 citations84
US6098638AAug 8, 2000
Method of manufacturing a semiconductor device and an apparatus for manufacturing the same
TOSHIBA KK18 citations83
US5858859AJan 12, 1999
Semiconductor device having a trench for device isolation fabrication method
TOSHIBA KK14 citations82
US5683908ANov 4, 1997
Method of fabricating trench isolation structure having tapered opening
TOSHIBA KK14 citations82
US6867138B2Mar 15, 2005
Method of chemical/mechanical polishing of the surface of semiconductor device
TOSHIBA KK5 citations74
US6716087B2Apr 6, 2004
Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
TOSHIBA KK5 citations74
USRE36328EOct 5, 1999
Semiconductor manufacturing apparatus including temperature control mechanism
TOSHIBA KK10 citations74
US5380399AJan 10, 1995
Method of treating semiconductor substrates
TOSHIBA KK15 citations73
US5332683AJul 26, 1994
Method of manufacturing semiconductor device having elements isolated by trench
TOSHIBA KK17 citations73
US5111272AMay 5, 1992
Semiconductor device having element regions electrically isolated from each other
TOSHIBA KK7 citations73
US7101259B2Sep 5, 2006
Polishing method and apparatus
TOSHIBA KK7 citations72
US6783658B2Aug 31, 2004
Electropolishing method
TOSHIBA KK2 citations58