Inventor
BAKER THERESA L
US4 patents
Patents
4 patentsUS5410184AApr 25, 1995
Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
MOTOROLA INC81 citations93
US6030684AFeb 29, 2000
Protecting electronic components in acidic and basic environment
MOTOROLA INC22 citations91
US5686162ANov 11, 1997
Protecting electronic components in acidic and basic environments
MOTOROLA INC24 citations91
US6436730B1Aug 20, 2002
Microelectronic package comprising tin copper solder bump interconnections and method for forming same
MOTOROLA INC30 citations90