Inventor
TAKAHASHI TAKUYA
JP112 patents
⚠️ This page may combine multiple inventors who share the name “TAKAHASHI TAKUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
12 patentsUS6433842B1Aug 13, 2002
Liquid crystal display device and method of manufacturing the same
HITACHI LTD213 citations98
US6674502B1Jan 6, 2004
Liquid crystal display with nitrided insulating substrate for TFT
HITACHI LTD42 citations92
US6522370B2Feb 18, 2003
Liquid crystal display units
HITACHI LTD15 citations92
US5519330AMay 21, 1996
Method and apparatus for measuring degree of corrosion of metal materials
HITACHI LTD44 citations92
US5203984AApr 20, 1993
Monitoring system for plant operation condition and its in-situ electrochemical electrode
HITACHI LTD40 citations92
US6731364B2May 4, 2004
Liquid crystal display device
HITACHI LTD16 citations84
US6392721B1May 21, 2002
Liquid crystal display device having wiring line including first and second layers with second layer having a thickness not greater than 1/2 of a thickness of first layer
HITACHI LTD19 citations84
US6707512B2Mar 16, 2004
Liquid crystal display units with data line being formed of molybdenum alloy having chromium content
HITACHI LTD6 citations74
US5186798AFeb 16, 1993
Solution quantitative analysis apparatus, quantitative analysis methods, and nuclear reactor water quality control system
HITACHI LTD7 citations74
US4937038AJun 26, 1990
Solution quantitative analysis apparatus, quantitative analysis methods, and nuclear reactor water quality control system
HITACHI LTD17 citations74
US5901071AMay 4, 1999
Method of evaluating corrosion resistance of metal material, method of designing alloy of high corrosion resistance, method of diagnosing corroded state of metal material, and method of operating plant
HITACHI LTD14 citations71
US6628361B2Sep 30, 2003
Liquid crystal display device and wiring structure therefor
HITACHI LTD12 citations69
TOSHIBA KK
11 patentsUS6153448ANov 28, 2000
Semiconductor device manufacturing method
TOSHIBA KK176 citations99
US5977641ANov 2, 1999
Semiconductor device and method for manufacturing the same
TOSHIBA KK134 citations99
US7552592B2Jun 30, 2009
Magnetic refrigerator
TOSHIBA KK68 citations98
US6031724AFeb 29, 2000
IC card and method of manufacturing the same
TOSHIBA KK34 citations93
USD476011SJun 17, 2003
IC card
TOSHIBA KK21 citations92
USD475713SJun 10, 2003
IC card
TOSHIBA KK20 citations92
USD475056SMay 27, 2003
IC card
TOSHIBA KK29 citations92
USD476012SJun 17, 2003
IC card
TOSHIBA KK14 citations84
USD479845SSep 23, 2003
IC card
TOSHIBA KK9 citations74
USD474774SMay 20, 2003
IC card
TOSHIBA KK10 citations74
US6803666B2Oct 12, 2004
Semiconductor chip mounting substrate and semiconductor device using the same
TOSHIBA KK12 citations71
JAPAN AVIATION ELECTRON
6 patentsUS6079988AJun 27, 2000
Electrical connector having spring contact with double contact projections as a contact region with contact pad of an external electronic component
JAPAN AVIATION ELECTRON28 citations93
US8834183B2Sep 16, 2014
Housingless connector
JAPAN AVIATION ELECTRON14 citations84
US7874867B2Jan 25, 2011
Electrical connection member with outer insulating film member and inner inclined spring member
JAPAN AVIATION ELECTRON7 citations84
US7766661B2Aug 3, 2010
Heat transfer member and connector
JAPAN AVIATION ELECTRON10 citations84
US7367838B2May 6, 2008
Intermediate connector
JAPAN AVIATION ELECTRON7 citations74
US5609492AMar 11, 1997
Electrical connector having linkage connecting cap with connector housing
JAPAN AVIATION ELECTRON15 citations72
SEIKO EPSON CORP
5 patentsUS6946380B2Sep 20, 2005
Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
SEIKO EPSON CORP115 citations99
US6921016B2Jul 26, 2005
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
SEIKO EPSON CORP27 citations93
US7314818B2Jan 1, 2008
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
SEIKO EPSON CORP16 citations92
US7064425B2Jun 20, 2006
Semiconductor device circuit board, and electronic equipment
SEIKO EPSON CORP16 citations92
US7176570B2Feb 13, 2007
Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
SEIKO EPSON CORP7 citations74
BRIDGESTONE TIRE CO LTD
3 patentsUS4244413AJan 13, 1981
Solid tire and wheel assembly for vehicle moving through a tubular conduit
BRIDGESTONE TIRE CO LTD30 citations91
US4191671AMar 4, 1980
Abrasion resistant rubber compositions
BRIDGESTONE TIRE CO LTD43 citations91
US4101626AJul 18, 1978
Method for molding an article expanded at the center portion and having the maximum inner diameter at said portion for a liquid elastomer
BRIDGESTONE TIRE CO LTD11 citations70
YAMAHA CORP
2 patentsTAKAHASHI TAKUYA
2 patentsKONICA MINOLTA INC
2 patentsSAITO AKIKO
1 patentJAPAN AVIATION ELECTRONICS IND LTD
1 patentHITACHI DISPLAYS LTD
1 patentPASCAL ENG CORP
1 patentHITACHI HIGH TECH CORP
1 patentMITSUBISHI ELECTRIC CORP
1 patentSONY CORP
1 patentShowing the top 50 of 112 patents by PatentIndex Score.