Inventor

TAKAMI MASASTO

JP2 patents

Patents

2 patents

US6524723B2Feb 25, 2003

Copper foil for printed circuit boards and its surface treatment method

FUKUDA METAL FOIL POWDER3 citations56

US6419811B2Jul 16, 2002

Method for surface treatment of copper foil

FUKUDA METAL FOIL POWDER5 citations56