Inventor
DANIELSON DONALD
US7 patents
Patents
7 patentsUS6417098B1Jul 9, 2002
Enhanced surface modification of low K carbon-doped oxide
INTEL CORP29 citations89
US6749760B2Jun 15, 2004
Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
INTEL CORP18 citations87
US7393772B2Jul 1, 2008
Wirebond structure and method to connect to a microelectronic die
INTEL CORP10 citations81
US7855103B2Dec 21, 2010
Wirebond structure and method to connect to a microelectronic die
INTEL CORP4 citations71
US6924554B2Aug 2, 2005
Wirebond structure and method to connect to a microelectronic die
INTEL CORP4 citations71
US6683383B2Jan 27, 2004
Wirebond structure and method to connect to a microelectronic die
INTEL CORP11 citations71
US7087996B2Aug 8, 2006
Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
INTEL CORP6 citations68