Inventor
HUANG TZEUN-LUH
US3 patents
Patents
3 patentsUS6749760B2Jun 15, 2004
Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
INTEL CORP18 citations87
US6740427B2May 25, 2004
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same
INTEL CORP13 citations81
US7087996B2Aug 8, 2006
Etchant formulation for selectively removing thin films in the presence of copper, tin, and lead
INTEL CORP6 citations68