Inventor
KANG HEE-SUNG
KR37 patents
⚠️ This page may combine multiple inventors who share the name “KANG HEE-SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
27 patentsUS6498370B1Dec 24, 2002
SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD87 citations98
US6521959B2Feb 18, 2003
SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD85 citations97
US6812111B2Nov 2, 2004
Methods for fabricating MOS transistors with notched gate electrodes
SAMSUNG ELECTRONICS CO LTD72 citations96
US6855641B2Feb 15, 2005
CMOS transistor having different PMOS and NMOS gate electrode structures and method of fabrication thereof
SAMSUNG ELECTRONICS CO LTD31 citations92
US6794716B2Sep 21, 2004
SOI MOSFET having body contact for preventing floating body effect and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD22 citations92
US6717209B1Apr 6, 2004
Semiconductor device having junction diode and fabricating method therefor
SAMSUNG ELECTRONICS CO LTD27 citations92
US7914973B2Mar 29, 2011
Method of forming a pattern in a semiconductor device and method of forming a gate using the same
SAMSUNG ELECTRONICS CO LTD12 citations91
US7323420B2Jan 29, 2008
Method for manufacturing multi-thickness gate dielectric layer of semiconductor device
SAMSUNG ELECTRONICS CO LTD11 citations84
US7179750B2Feb 20, 2007
Method for manufacturing multi-thickness gate dielectric layer of semiconductor device
SAMSUNG ELECTRONICS CO LTD11 citations84
US6541822B2Apr 1, 2003
Method of manufacturing an SOI type semiconductor that can restrain floating body effect
SAMSUNG ELECTRONICS CO LTD15 citations84
US8952423B2Feb 10, 2015
Semiconductor device having decoupling capacitors and dummy transistors
SAMSUNG ELECTRONICS CO LTD7 citations83
US7781282B2Aug 24, 2010
Shared contact structure, semiconductor device and method of fabricating the semiconductor device
SAMSUNG ELECTRONICS CO LTD13 citations83
US7348636B2Mar 25, 2008
CMOS transistor having different PMOS and NMOS gate electrode structures and method of fabrication thereof
SAMSUNG ELECTRONICS CO LTD11 citations83
US7550822B2Jun 23, 2009
Dual-damascene metal wiring patterns for integrated circuit devices
SAMSUNG ELECTRONICS CO LTD13 citations82
US7052965B2May 30, 2006
Methods of fabricating MOS field effect transistors with pocket regions using implant blocking patterns
SAMSUNG ELECTRONICS CO LTD9 citations74
US6706569B2Mar 16, 2004
SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD10 citations74
US6703280B2Mar 9, 2004
SOI semiconductor integrated circuit for eliminating floating body effects in SOI MOSFETs and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations74
US7217625B2May 15, 2007
Method of fabricating a semiconductor device having a shallow source/drain region
SAMSUNG ELECTRONICS CO LTD2 citations63
US6902959B2Jun 7, 2005
Semiconductor device having junction diode and fabricating method therefor
SAMSUNG ELECTRONICS CO LTD5 citations63
US7285831B2Oct 23, 2007
CMOS device with improved performance and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations62
US9111880B2Aug 18, 2015
Method of forming a pattern in a semiconductor device and method of forming a gate using the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US8846304B2Sep 30, 2014
Method of forming a pattern in a semiconductor device and method of forming a gate using the same
SAMSUNG ELECTRONICS CO LTD2 citations61
US7410843B2Aug 12, 2008
Methods for fabricating reduced floating body effect static random access memory cells
SAMSUNG ELECTRONICS CO LTD2 citations60
US7105900B2Sep 12, 2006
Reduced floating body effect static random access memory cells and methods for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations60
US7045429B2May 16, 2006
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD6 citations58
US7364987B2Apr 29, 2008
Method for manufacturing semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US7179714B2Feb 20, 2007
Method of fabricating MOS transistor having fully silicided gate
SAMSUNG ELECTRONICS CO LTD0 citations35
SK HYNIX INC
3 patentsUS9773840B2Sep 26, 2017
Semiconductor memory with reduced contact margin
SK HYNIX INC2 citations73
US9065046B2Jun 23, 2015
Semiconductor device and method for fabricating the same, and microprocessor, processor, system, data storage system and memory system including the semiconductor device
SK HYNIX INC2 citations63
US10497749B2Dec 3, 2019
Electronic device
SK HYNIX INC0 citations52
POSCO CO LTD
2 patentsUS12134811B2Nov 5, 2024
High-strength hot-rolled steel sheet having excellent bendability and low-temperature and method for manufacturing same
POSCO CO LTD0 citations57
US11732339B2Aug 22, 2023
High-strength hot-rolled steel sheet having excellent bendability and low-temperature and method for manufacturing same
POSCO CO LTD0 citations57