P

Inventor

ZENG XIAOGUANG

CN8 patents
⚠️ This page may combine multiple inventors who share the name “ZENG XIAOGUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GEM SERVICES INC

3 patents
US7382044B1Jun 3, 2008

Semiconductor device package diepad having features formed by electroplating

GEM SERVICES INC24 citations90
US7122406B1Oct 17, 2006

Semiconductor device package diepad having features formed by electroplating

GEM SERVICES INC38 citations90
US7553700B2Jun 30, 2009

Chemical-enhanced package singulation process

GEM SERVICES INC0 citations45

ALPHA & OMEGA SEMICONDUCTOR INT LP

2 patents
US12261101B2Mar 25, 2025

Semiconductor package having wettable lead flanks and tie bars and method of making the same

ALPHA & OMEGA SEMICONDUCTOR INT LP0 citations51
US12142548B2Nov 12, 2024

Semiconductor package having mold locking feature

ALPHA & OMEGA SEMICONDUCTOR INT LP0 citations44

ZHANG XIAOTIAN

1 patent
US8669650B2Mar 11, 2014

Flip chip semiconductor device

ZHANG XIAOTIAN5 citations72

ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD

1 patent
US10600727B2Mar 24, 2020

Molded intelligent power module for motors

ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD4 citations68

ALPHA & OMEGA SEMICONDUCTOR

1 patent
US9437587B2Sep 6, 2016

Flip chip semiconductor device

ALPHA & OMEGA SEMICONDUCTOR2 citations62