Inventor
CHANG HUI LIN
TW26 patents
⚠️ This page may combine multiple inventors who share the name “CHANG HUI LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
16 patentsUS8053356B2Nov 8, 2011
Interconnect structure for semiconductor devices
TAIWAN SEMICONDUCTOR MFG9 citations92
US7312531B2Dec 25, 2007
Semiconductor device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG22 citations92
US7250370B2Jul 31, 2007
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
TAIWAN SEMICONDUCTOR MFG19 citations91
US7094705B2Aug 22, 2006
Multi-step plasma treatment method to improve CU interconnect electrical performance
TAIWAN SEMICONDUCTOR MFG28 citations90
US7129164B2Oct 31, 2006
Method for forming a multi-layer low-K dual damascene
TAIWAN SEMICONDUCTOR MFG11 citations84
US7642189B2Jan 5, 2010
Synergy effect of alloying materials in interconnect structures
TAIWAN SEMICONDUCTOR MFG6 citations74
US7655556B2Feb 2, 2010
Interconnect structures for semiconductor devices
TAIWAN SEMICONDUCTOR MFG6 citations73
US7977791B2Jul 12, 2011
Selective formation of boron-containing metal cap pre-layer
TAIWAN SEMICONDUCTOR MFG3 citations63
US7897505B2Mar 1, 2011
Method for enhancing adhesion between layers in BEOL fabrication
TAIWAN SEMICONDUCTOR MFG2 citations63
US7456093B2Nov 25, 2008
Method for improving a semiconductor device delamination resistance
TAIWAN SEMICONDUCTOR MFG3 citations63
US7834458B2Nov 16, 2010
Interconnect structure for semiconductor devices
TAIWAN SEMICONDUCTOR MFG2 citations62
US7352053B2Apr 1, 2008
Insulating layer having decreased dielectric constant and increased hardness
TAIWAN SEMICONDUCTOR MFG4 citations62
US9219036B2Dec 22, 2015
Interconnect structure for semiconductor devices
TAIWAN SEMICONDUCTOR MFG0 citations52
US8999842B2Apr 7, 2015
Interconnect structure for semiconductor devices
TAIWAN SEMICONDUCTOR MFG0 citations52
US8785324B2Jul 22, 2014
Interconnect structure for semiconductor devices
TAIWAN SEMICONDUCTOR MFG0 citations52
US7629273B2Dec 8, 2009
Method for modulating stresses of a contact etch stop layer
TAIWAN SEMICONDUCTOR MFG0 citations51
CHANG HUI-LIN
4 patentsUS8158521B2Apr 17, 2012
Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties
CHANG HUI-LIN9 citations81
US9385034B2Jul 5, 2016
Carbonization of metal caps
CHANG HUI-LIN3 citations71
US8330275B2Dec 11, 2012
Interconnect structure for semiconductor devices
CHANG HUI-LIN0 citations51
US8264046B2Sep 11, 2012
Synergy effect of alloying materials in interconnect structures
CHANG HUI-LIN0 citations51