Inventor

WANG DAVID WEI

US25 patents

⚠️ This page may combine multiple inventors who share the name “WANG DAVID WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG DAVID WEI

CHIPMOS TECHNOLOGIES INC

Semiconductor package structure and method for manufacturing the same

Fabricating process of a chip package structure

Chip package

Fabricating process of a chip package structure

Chip package

Thermally enhanced electronic package

Chip package structure

SCHLUMBERGER TECHNOLOGY CORP

Mesh screen apparatus and method of manufacture

Gravel packing a well

Gravel packing a well

System and method for forming downhole connections

Joining tubular members

WANG DAVID WEI

Deformable dart and method

Downhole wet mate connection

Multi-chip stack package structure

Multi-chip stack package structure

Multi-chip stack package structure

IBM

Solder interconnection structure

Solder interconnection structure and process for making

Encapsulating a solder joint with a photo cured epoxy resin or cyanate

Thermally stable photoimaging composition

LONGFIELD COLIN

Downhole piezoelectric devices

BROADCOM CORP

Media access control security (MACsec) management with a layer management interface (LMI) configured to communication over management data input/output (MDIO) protocol

LEE JONATHAN F

Cable sense mode for intelligent power saving in absence of link pulse

LIU AN HONG

Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same