Inventor
MAEDA YASUHIRO
JP72 patents
⚠️ This page may combine multiple inventors who share the name “MAEDA YASUHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOBE STEEL LTD
17 patentsUS10974673B2Apr 13, 2021
Vehicular structure
KOBE STEEL LTD11 citations84
US11472359B2Oct 18, 2022
Structural member for vehicle
KOBE STEEL LTD2 citations72
US11072373B2Jul 27, 2021
Vehicle structural member and method for producing same
KOBE STEEL LTD4 citations72
US10926314B2Feb 23, 2021
Method for joining bumper members and bumper structure
KOBE STEEL LTD4 citations71
US11969777B2Apr 30, 2024
Structure and method for producing same
KOBE STEEL LTD0 citations62
US11701701B2Jul 18, 2023
Method for joining members
KOBE STEEL LTD0 citations62
US11052446B2Jul 6, 2021
Method for joining members, and joint body
KOBE STEEL LTD0 citations62
US10843251B2Nov 24, 2020
Method for joining members
KOBE STEEL LTD1 citations62
US10744552B2Aug 18, 2020
Joining method for members
KOBE STEEL LTD1 citations62
US10906079B2Feb 2, 2021
Manufacturing method and manufacturing device for composite cross-section member
KOBE STEEL LTD0 citations61
US10787137B2Sep 29, 2020
Structural member
KOBE STEEL LTD1 citations60
US11345294B2May 31, 2022
Vehicle structure and method for manufacturing the same
KOBE STEEL LTD0 citations59
US12285795B2Apr 29, 2025
Method for joining members and joined body
KOBE STEEL LTD0 citations57
US11433450B2Sep 6, 2022
Joined body and method for manufacturing same
KOBE STEEL LTD0 citations52
US11229942B2Jan 25, 2022
Joining method and joint structure of members
KOBE STEEL LTD0 citations52
US11198172B2Dec 14, 2021
Method and device for joining members
KOBE STEEL LTD0 citations52
US11052448B2Jul 6, 2021
Member joining device and member joining method
KOBE STEEL LTD0 citations52
ADVANTEST CORP
9 patentsUS6937040B2Aug 30, 2005
Probe module and a testing apparatus
ADVANTEST CORP71 citations95
US6423558B1Jul 23, 2002
Method for fabricating integrated circuit (IC) dies with multi-layered interconnect structures
ADVANTEST CORP46 citations93
US6809539B2Oct 26, 2004
Probe card for testing an integrated circuit
ADVANTEST CORP32 citations92
US6657196B2Dec 2, 2003
Method and apparatus for environmental monitoring
ADVANTEST CORP30 citations92
US6433339B1Aug 13, 2002
Surface state monitoring method and apparatus
ADVANTEST CORP20 citations92
US6508990B1Jan 21, 2003
Substrate treating method and apparatus
ADVANTEST CORP36 citations91
US6476393B1Nov 5, 2002
Surface state monitoring method and apparatus
ADVANTEST CORP19 citations82
US6590479B2Jul 8, 2003
Integrated microcontact pin and method for manufacturing the same
ADVANTEST CORP10 citations70
US7243410B2Jul 17, 2007
Method for manufacturing a probe card
ADVANTEST CORP2 citations63
HOXAN KK
3 patentsUS4561486ADec 31, 1985
Method for fabricating polycrystalline silicon wafer
HOXAN KK37 citations90
US4519764AMay 28, 1985
Apparatus for fabricating polycrystalline silicon wafer
HOXAN KK8 citations71
US5167758ADec 1, 1992
Method of forming polycrystalline silicon layer on semiconductor wafer
HOXAN KK2 citations56
NISHINA KOGYO KK
2 patentsSUMITOMO ELECTRIC INDUSTRIES
2 patentsMITSUBISHI ELECTRIC CORP
2 patentsNEC CORP
2 patentsHONDA MOTOR CO LTD
2 patentsOLYMPUS CORP
2 patentsMITSUI PETROCHEMICAL IND
1 patentTOYOTA MOTOR CO LTD
1 patentNISSHIN STEEL CO LTD
1 patentHASHIMOTO MINORU
1 patentNIPPON ABS LTD
1 patentYUAN RUI RONG
1 patentTOYODA AUTOMATIC LOOM WORKS
1 patentKEIHIN CORP
1 patentMAEDA YASUHIRO
1 patentShowing the top 50 of 72 patents by PatentIndex Score.