Inventor
CHERNIAWSKI MICHAEL R
US3 patents
Patents
3 patentsUS5937324AAug 10, 1999
Method for forming a line-on-line multi-level metal interconnect structure for use in integrated circuits
MOTOROLA INC67 citations93
US5798568AAug 25, 1998
Semiconductor component with multi-level interconnect system and method of manufacture
MOTOROLA INC50 citations93
US5024972AJun 18, 1991
Deposition of a conductive layer for contacts
MOTOROLA INC4 citations57