P

Inventor

ELENIUS PETER

US11 patents
⚠️ This page may combine multiple inventors who share the name “ELENIUS PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FLIP CHIP TECHNOLOGIES L L C

4 patents
US6578755B1Jun 17, 2003

Polymer collar for solder bumps

FLIP CHIP TECHNOLOGIES L L C88 citations96
US6441487B2Aug 27, 2002

Chip scale package using large ductile solder balls

FLIP CHIP TECHNOLOGIES L L C182 citations96
US6287893B1Sep 11, 2001

Method for forming chip scale package

FLIP CHIP TECHNOLOGIES L L C241 citations96
US6750135B2Jun 15, 2004

Method for forming chip scale package

FLIP CHIP TECHNOLOGIES L L C64 citations93

FLIPCHIP INT LLC

2 patents
US7057292B1Jun 6, 2006

Solder bar for high power flip chips

FLIPCHIP INT LLC30 citations92
US7118833B2Oct 10, 2006

Forming partial-depth features in polymer film

FLIPCHIP INT LLC5 citations62

FLIPCHIP INTERNAT LLC

1 patent
US7126164B2Oct 24, 2006

Wafer-level moat structures

FLIPCHIP INTERNAT LLC10 citations68

PPG IND OHIO INC

1 patent
US7485812B2Feb 3, 2009

Single or multi-layer printed circuit board with improved via design

PPG IND OHIO INC4 citations61

IBM

1 patent
US5397604AMar 14, 1995

Non-contact fluid applicator apparatus and method

IBM3 citations59

ELENIUS PETER

1 patent
US8487437B2Jul 16, 2013

Electronic device package and method for fabricating the same

ELENIUS PETER3 citations56

OLSON KEVIN C

1 patent
US8141245B2Mar 27, 2012

Method of forming a circuit board with improved via design

OLSON KEVIN C1 citations49