P

Inventor

DAVIES-VENN EMILE

US7 patents
⚠️ This page may combine multiple inventors who share the name “DAVIES-VENN EMILE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

4 patents
US7626472B2Dec 1, 2009

Package embedded three dimensional balun

INTEL CORP28 citations91
US10510667B2Dec 17, 2019

Conductive coating for a microelectronics package

INTEL CORP4 citations70
US10910314B2Feb 2, 2021

Conductive coating for a microelectronics package

INTEL CORP1 citations60
US11295998B2Apr 5, 2022

Stiffener and package substrate for a semiconductor package

INTEL CORP0 citations54

KAMGAING TELESPHOR

2 patents
US8804366B2Aug 12, 2014

Package-based filtering and matching solutions

KAMGAING TELESPHOR3 citations61
US8111521B2Feb 7, 2012

Package-based filtering and matching solutions

KAMGAING TELESPHOR3 citations61

TEH WENG HONG

1 patent
US9520350B2Dec 13, 2016

Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer

TEH WENG HONG5 citations71