Inventor
RAMAKRISHNA KAMBHAMPATI
US32 patents
⚠️ This page may combine multiple inventors who share the name “RAMAKRISHNA KAMBHAMPATI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
12 patentsUS7364945B2Apr 29, 2008
Method of mounting an integrated circuit package in an encapsulant cavity
STATS CHIPPAC LTD100 citations99
US7429787B2Sep 30, 2008
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides
STATS CHIPPAC LTD88 citations98
US7372141B2May 13, 2008
Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
STATS CHIPPAC LTD109 citations98
US7399658B2Jul 15, 2008
Pre-molded leadframe and method therefor
STATS CHIPPAC LTD80 citations97
US7855100B2Dec 21, 2010
Integrated circuit package system with an encapsulant cavity and method of fabrication thereof
STATS CHIPPAC LTD15 citations93
US7795078B2Sep 14, 2010
Leadframe package for MEMS microphone assembly
STATS CHIPPAC LTD40 citations93
US8021924B2Sep 20, 2011
Encapsulant cavity integrated circuit package system and method of fabrication thereof
STATS CHIPPAC LTD9 citations84
US7790504B2Sep 7, 2010
Integrated circuit package system
STATS CHIPPAC LTD14 citations84
US7622800B2Nov 24, 2009
Stacked semiconductor packages and method therefor
STATS CHIPPAC LTD9 citations84
US7242091B2Jul 10, 2007
Stacked semiconductor packages and method therefor
STATS CHIPPAC LTD5 citations74
US8050047B2Nov 1, 2011
Integrated circuit package system with flexible substrate and recessed package
STATS CHIPPAC LTD3 citations63
US8031475B2Oct 4, 2011
Integrated circuit package system with flexible substrate and mounded package
STATS CHIPPAC LTD3 citations63
ST ASSEMBLY TEST SERVICES LTD
6 patentsUS6861288B2Mar 1, 2005
Stacked semiconductor packages and method for the fabrication thereof
ST ASSEMBLY TEST SERVICES LTD308 citations99
US7309913B2Dec 18, 2007
Stacked semiconductor packages
ST ASSEMBLY TEST SERVICES LTD94 citations98
US6927479B2Aug 9, 2005
Method of manufacturing a semiconductor package for a die larger than a die pad
ST ASSEMBLY TEST SERVICES LTD37 citations92
US7091469B2Aug 15, 2006
Packaging for optoelectronic devices
ST ASSEMBLY TEST SERVICES LTD6 citations69
US7595551B2Sep 29, 2009
Semiconductor package for a large die
ST ASSEMBLY TEST SERVICES LTD3 citations63
US7863730B2Jan 4, 2011
Array-molded package heat spreader and fabrication method therefor
ST ASSEMBLY TEST SERVICES LTD5 citations62
RAMAKRISHNA KAMBHAMPATI
5 patentsUS8178982B2May 15, 2012
Dual molded multi-chip package system
RAMAKRISHNA KAMBHAMPATI3 citations62
US8106496B2Jan 31, 2012
Semiconductor packaging system with stacking and method of manufacturing thereof
RAMAKRISHNA KAMBHAMPATI5 citations62
US8211753B2Jul 3, 2012
Leadframe-based mold array package heat spreader and fabrication method therefor
RAMAKRISHNA KAMBHAMPATI5 citations60
US8558399B2Oct 15, 2013
Dual molded multi-chip package system
RAMAKRISHNA KAMBHAMPATI0 citations51
US8581375B2Nov 12, 2013
Leadframe-based mold array package heat spreader and fabrication method therefor
RAMAKRISHNA KAMBHAMPATI0 citations50
AMKOR TECHNOLOGY INC
3 patentsUS6531784B1Mar 11, 2003
Semiconductor package with spacer strips
AMKOR TECHNOLOGY INC299 citations99
US6650019B2Nov 18, 2003
Method of making a semiconductor package including stacked semiconductor dies
AMKOR TECHNOLOGY INC123 citations98
US6472758B1Oct 29, 2002
Semiconductor package including stacked semiconductor dies and bond wires
AMKOR TECHNOLOGY INC193 citations98