Inventor
KESAPRAGADA SREE RANGASAI V
US8 patents
Patents
8 patentsUS10109520B2Oct 23, 2018
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers
APPLIED MATERIALS INC2 citations72
US9601431B2Mar 21, 2017
Dielectric/metal barrier integration to prevent copper diffusion
APPLIED MATERIALS INC4 citations72
US9299605B2Mar 29, 2016
Methods for forming passivation protection for an interconnection structure
APPLIED MATERIALS INC3 citations72
US10991617B2Apr 27, 2021
Methods and apparatus for cleaving of semiconductor substrates
APPLIED MATERIALS INC2 citations69
US11610807B2Mar 21, 2023
Methods and apparatus for cleaving of semiconductor substrates
APPLIED MATERIALS INC0 citations59
US11569122B2Jan 31, 2023
Methods and apparatus for cleaving of semiconductor substrates
APPLIED MATERIALS INC0 citations59
US10707122B2Jul 7, 2020
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers
APPLIED MATERIALS INC0 citations51
US10559578B2Feb 11, 2020
Deposition of cobalt films with high deposition rate
APPLIED MATERIALS INC0 citations50