Inventor
HWANG JUN-OH
KR12 patents
⚠️ This page may combine multiple inventors who share the name “HWANG JUN-OH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
9 patentsUS10026678B1Jul 17, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH8 citations83
US11259404B2Feb 22, 2022
Rigid-flexible printed circuit board and electronic component module
SAMSUNG ELECTRO MECH2 citations71
US11172574B2Nov 9, 2021
Printed circuit board assembly
SAMSUNG ELECTRO MECH2 citations71
US11134576B2Sep 28, 2021
Printed circuit board
SAMSUNG ELECTRO MECH2 citations71
US10396037B2Aug 27, 2019
Fan-out semiconductor device
SAMSUNG ELECTRO MECH4 citations68
US10283439B2May 7, 2019
Fan-out semiconductor package including electromagnetic interference shielding layer
SAMSUNG ELECTRO MECH1 citations62
US8377748B2Feb 19, 2013
Method of manufacturing cooling fin and package substrate with cooling fin
SAMSUNG ELECTRO MECH2 citations61
US11715821B2Aug 1, 2023
Electronic element module and printed circuit board for the same
SAMSUNG ELECTRO MECH0 citations60
US12089337B2Sep 10, 2024
Circuit board
SAMSUNG ELECTRO MECH0 citations50