Inventor
HUANG HSIN-YEH
TW4 patents
Patents
4 patentsUS12394724B2Aug 19, 2025
Chip package structure and electromagnetic interference shielding package module thereof
AZUREWAVE TECH INC0 citations45
US12374629B2Jul 29, 2025
Electromagnetic interference shielding package structure, manufacturing method thereof, and electronic assembly
AZUREWAVE TECH INC0 citations45
US11538730B2Dec 27, 2022
Chip scale package structure of heat-dissipating type
AZUREWAVE TECH INC0 citations45
US11309626B2Apr 19, 2022
Wireless communication device
AZUREWAVE TECH INC0 citations45