Inventor

LAVOIE ADRIEN R

US28 patents

⚠️ This page may combine multiple inventors who share the name “LAVOIE ADRIEN R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAVOIE ADRIEN R

INTEL CORP

Tunable gate electrode work function material for transistor applications

Silicon-alloy based barrier layers for integrated circuit metal interconnects

Sealants for metal interconnect protection in microelectronic devices having air gap interconnect structures

Catalytically enhanced atomic layer deposition process

Catalytic nucleation monolayer for metal seed layers

Selectively depositing aluminum in a replacement metal gate process

Method of fabricating a carbon nanotube interconnect structures

Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill

Using unstable nitrides to form semiconductor structures

Amine-free deposition of metal-nitride films

Deposition process for iodine-doped ruthenium barrier layers

Direct tailoring of the composition and density of ALD films

Liquid phase molecular self-assembly for barrier deposition and structures formed thereby

Using unstable nitrides to form semiconductor structures

Atomic layer volatilization process for metal layers

Using unstable nitrides to form semiconductor structures

Boundaries with elevated deuterium levels

Group II element alloys for protecting metal interconnects

Deposition method for high-k dielectric materials

LAVOIE ADRIEN R

Methods and architectures for bottomless interconnect vias

Tunable gate electrode work function material for transistor applications

IC solder reflow method and materials

Electroless treatment of noble metal barrier and adhesion layer

Reliability of high-K gate dielectric layers

Noble metal barrier layers

DOMINGUEZ JUAN E

Surface charge enhanced atomic layer deposition of pure metallic films

ADVANCED TECH MATERIALS

Copper precursors for CVD/ALD/digital CVD of copper metal films

BUDREVICH AARON A

Group II element alloys for protecting metal interconnects