Inventor · disambiguated record
Jeffrey Lien
Also filed as: LIEN JEFFREY · LIEN JEFFREY R
7 granted patents·11 pending applications·83 citations·filing 2004–2015
82Inventor score
Top patents by PatentIndex Score
18 records- 0189US10713699B1Generation of guide materialsANDERSEN CORP·Filed 2015·Granted Jul 14, 2020·53 cites·29 claims
- 0266US7074651B2Packaging method for integrated circuitsOPTIMUM CARE INT TECH INC·Filed 2004·Granted Jul 11, 2006·16 cites·3 claims
- 0361US7138704B2Concealable chip leadframe unit structureOPTIMUM CARE INT TECH INC·Filed 2004·Granted Nov 21, 2006·12 cites·8 claims
- 0452US8703261B2Photoluminescent sleeveLIEN JEFFREY R·Filed 2009·Granted Apr 22, 2014·2 cites·31 claims
- 0548US9134013B2Photoluminescent sleeveLITROVISION LLC·Filed 2014·Granted Sep 15, 2015·0 cites·2 claims
- 0644US2007275574A1Chip Assembly Structure With CoverOPTIMUM CARE INT TECH INC·Filed 2007·Application pending·0 cites
- 0739US2007004093A1Method of fabricating a high-density lead arrangement package structureOPTIMUM CARE INT TECH INC·Filed 2006·Application pending·0 cites
- 0839US2007132111A1Fine-sized chip package structureOPTIMUM CARE INT TECH INC·Filed 2006·Application pending·0 cites
- 0938US2005121224A1Circuit board having deposit holesOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1038US2005117314A1Assembly structure for hiding electronic componentsOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1137US2006051899A1Method of forming precision leads on a chip-supporting leadframeOPTIMUM CARE INT TECH INC·Filed 2005·Application pending·0 cites
- 1236US7309918B2Chip package structureOPTIMUM CARE INT TECH INC·Filed 2004·Granted Dec 18, 2007·0 cites·8 claims
- 1335US2005116325A1Switching media for chip carrier deviceOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1435US2005179119A1Miniaturized chip scale package structureOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1535US2005156289A1Semiconductor chip leadframe moduleOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1635US2005224927A1Chip fixed structureOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1735US2005184365A1High density lead arrangement package structureOPTIMUM CARE INT TECH INC·Filed 2004·Application pending·0 cites
- 1826US7204017B2Manufacturing method of a modularized leadframeOPTIMUM CARE INT TECH INC·Filed 2004·Granted Apr 17, 2007·0 cites·5 claims
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