Inventor
EMERY RICHARD D
US4 patents
Patents
4 patentsUS7095111B2Aug 22, 2006
Package with integrated wick layer and method for heat removal
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US7091108B2Aug 15, 2006
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
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US7531429B2May 12, 2009
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
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US7952190B2May 31, 2011
Fabrication of microelectronic devices
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