Inventor
CHU ALBERT
US13 patents
⚠️ This page may combine multiple inventors who share the name “CHU ALBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS12268031B2Apr 1, 2025
Backside power rails and power distribution network for density scaling
IBM2 citations74
US11658116B2May 23, 2023
Interconnects on multiple sides of a semiconductor structure
IBM2 citations73
US10832971B2Nov 10, 2020
Fabricating tapered semiconductor devices
IBM2 citations73
US10755969B2Aug 25, 2020
Multi-patterning techniques for fabricating an array of metal lines with different widths
IBM5 citations72
US10614877B1Apr 7, 2020
4T static random access memory bitcell retention
IBM3 citations71
US12575399B2Mar 10, 2026
Interconnect structure including vertically stacked power and ground lines
IBM0 citations62
US12349458B2Jul 1, 2025
Staggered stacked circuits with increased effective width
IBM0 citations62
US12001772B2Jun 4, 2024
Ultra-short-height standard cell architecture
IBM0 citations62
US11355401B1Jun 7, 2022
Field effect transistor
IBM0 citations52
US10742218B2Aug 11, 2020
Vertical transport logic circuit cell with shared pitch
IBM0 citations51
US12142656B2Nov 12, 2024
Staggered stacked semiconductor devices
IBM0 citations47