Inventor
CHAMBERLIN BRUCE J
US40 patents
Patents
40 patentsUS6407341B1Jun 18, 2002
Conductive substructures of a multilayered laminate
IBM138 citations97
US6235994B1May 22, 2001
Thermal/electrical break for printed circuit boards
IBM67 citations95
US7709951B2May 4, 2010
Thermal pillow
IBM27 citations92
US6495772B2Dec 17, 2002
High performance dense wire for printed circuit board
IBM35 citations92
US9839131B2Dec 5, 2017
Embedding a discrete electrical device in a printed circuit board
IBM7 citations84
US7795724B2Sep 14, 2010
Sandwiched organic LGA structure
IBM16 citations84
US7109722B2Sep 19, 2006
Apparatus and method for PCB smoke and burn detection and prevention
IBM16 citations84
US7856341B2Dec 21, 2010
Heat sink
IBM11 citations82
US10405421B2Sep 3, 2019
Selective dielectric resin application on circuitized core layers
IBM3 citations73
US9863875B1Jan 9, 2018
In-situ detection of hollow glass fiber formation
IBM2 citations73
US7137826B2Nov 21, 2006
Temperature dependent semiconductor module connectors
IBM8 citations73
US7128579B1Oct 31, 2006
Hook interconnect
IBM7 citations73
US6832436B2Dec 21, 2004
Method for forming a substructure of a multilayered laminate
IBM8 citations72
US10194537B2Jan 29, 2019
Minimizing printed circuit board warpage
IBM2 citations71
US9986637B2May 29, 2018
Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same
IBM3 citations71
US11178757B2Nov 16, 2021
Selective dielectric resin application on circuitized core layers
IBM0 citations62
US10982060B2Apr 20, 2021
Glass-free dielectric layers for printed circuit boards
IBM0 citations62
US10959339B2Mar 23, 2021
Manufacturing a product using a soldering process
IBM0 citations62
US10932363B2Feb 23, 2021
Glass fiber coatings for improved resistance to conductive anodic filament formation
IBM0 citations62
US9398702B2Jul 19, 2016
Manufacturing a product using a soldering process
IBM2 citations62
US6426466B1Jul 30, 2002
Peripheral power board structure
IBM5 citations62
US11523519B2Dec 6, 2022
Fabricating an asymmetric printed circuit board with minimized warpage
IBM0 citations60
US9456496B2Sep 27, 2016
Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same
IBM2 citations60
US7355125B2Apr 8, 2008
Printed circuit board and chip module
IBM4 citations60
US11059120B2Jul 13, 2021
Non-destructive identifying of plating dissolution in soldered, plated through-hole
IBM0 citations52
US10684220B2Jun 16, 2020
In-situ detection of glass fiber defects
IBM0 citations52
US10590037B2Mar 17, 2020
Liquid immersion techniques for improved resistance to conductive anodic filament formation
IBM0 citations52
US10578551B2Mar 3, 2020
In-situ detection of hollow glass fiber formation
IBM0 citations52
US10492289B2Nov 26, 2019
Coating for limiting substrate damage due to discrete failure
IBM0 citations52
US10470290B2Nov 5, 2019
Coating for limiting substrate damage due to discrete failure
IBM0 citations52
US10462900B2Oct 29, 2019
Glass fiber coatings for improved resistance to conductive anodic filament formation
IBM0 citations52
US10342122B2Jul 2, 2019
Interface for limiting substrate damage due to discrete failure
IBM0 citations52
US10172243B2Jan 1, 2019
Printed circuit board and methods to enhance reliability
IBM0 citations52
US10149388B2Dec 4, 2018
Method for embedding a discrete electrical device in a printed circuit board
IBM0 citations52
US10080283B1Sep 18, 2018
Interface for limiting substrate damage due to discrete failure
IBM0 citations52
US10010000B2Jun 26, 2018
Manufacturing a product using a soldering process
IBM0 citations52
US7255571B2Aug 14, 2007
Temperature dependent semiconductor module connectors
IBM1 citations52
US7742315B2Jun 22, 2010
Circuit on a printed circuit board
IBM1 citations51
US6894228B2May 17, 2005
High performance dense wire for printed circuit board
IBM1 citations51
US10801137B2Oct 13, 2020
Glass cloth including attached fibers
IBM0 citations42