Inventor

HOFFMEYER MARK K

US56 patents

⚠️ This page may combine multiple inventors who share the name “HOFFMEYER MARK K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOFFMEYER MARK K

IBM

Heatsink and package structures with fusible release layer

Capped solder bumps which form an interconnection with a tailored reflow melting point

Universal surface finish for DCA, SMT and pad on pad interconnections

Method of performing solder joint analysis of semi-conductor components

Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor

Multi layer thermal interface material

Adhesive-bonded thermal interface structures

Thermal interface material structures

Eye-of-needle compliant pin

Twisted eye-of-needle compliant pin

Testing printed circuit board assembly

Area array device connection structures with complimentary warp characteristics

Integrated circuit device assembly

Heat sink

Land grid array electrical contact coating

Thermal interface material structures

Adhesive-bonded thermal interface structures

Implementing reworkable strain relief packaging structure for electronic component interconnects

Liquid metal infiltration rework of electronic assembly

Liquid metal infiltration rework of electronic assembly

Efficient placement of grid array components

Testing printed circuit board assembly

Area array device connection structures with complimentary warp characteristics

Integrated circuit device assembly

Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization

Applying a solderable surface to conductive ink

Applying a solderable surface to conductive ink

Thermal interface material structures

Standoff and support structures for reliable land grid array and hybrid land grid array interconnects

Liquid metal infiltration rework of electronic assembly

Reliability enhancement of press fit connectors

Pierced thermal interface constructions

Liquid metal infiltration rework of electronic assembly

Thermal interface material structures for directing heat in a three-dimensional space

Integrated circuit module with a structurally balanced package using a bottom side interposer

Reliability enhancement of press fit connectors

Thermal interface material structures for directing heat in a three-dimensional space

Connecting a component to a substrate by adhesion to an oxidized solder surface

Integrated circuit module with a structurally balanced package using a bottom side interposer

Tamper-respondent sensors with liquid crystal polymer layers

Fixture facilitating heat sink fabrication

Fixture facilitating heat sink fabrication

Thermal interface materials with radiative coupling heat transfer

Computer system with modified module socket

Implementing reworkable strain relief packaging structure for electronic component interconnects

Adhesive-bonded thermal interface structures

BEAMAN BRIAN S

Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing

BRAUN DAVID J

Metal substrate double sided circuit board

WISCONSIN ALUMNI RES FOUND

Method of evaluation and identification for the design of effective inoculation agents

HOFFMEYER MARK K

Implementing hybrid molded solder-embedded pin contacts and connectors