Inventor
KELLY MATTHEW S
CA31 patents
⚠️ This page may combine multiple inventors who share the name “KELLY MATTHEW S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
28 patentsUS10048312B1Aug 14, 2018
Testing printed circuit board assembly
IBM9 citations83
US7856341B2Dec 21, 2010
Heat sink
IBM11 citations82
US10405421B2Sep 3, 2019
Selective dielectric resin application on circuitized core layers
IBM3 citations73
US10679926B2Jun 9, 2020
Method of making integrated die paddle structures for bottom terminated components
IBM1 citations72
US10168383B2Jan 1, 2019
Testing printed circuit board assembly
IBM2 citations72
US11619665B2Apr 4, 2023
Electrical apparatus having tin whisker sensing and prevention
IBM2 citations71
US9317643B2Apr 19, 2016
Technology for temperature sensitive components in thermal processing
IBM4 citations68
US11403580B2Aug 2, 2022
Advising audit ratings in a multiple-auditor environment
IBM1 citations62
US11178757B2Nov 16, 2021
Selective dielectric resin application on circuitized core layers
IBM0 citations62
US10932363B2Feb 23, 2021
Glass fiber coatings for improved resistance to conductive anodic filament formation
IBM0 citations62
US11488571B2Nov 1, 2022
Anti-eavesdrop security device
IBM0 citations60
US12174241B2Dec 24, 2024
Apparatus and method for tin whisker isolation and detection
IBM0 citations59
US10141703B1Nov 27, 2018
Connector module having insulated metal frame
IBM1 citations57
US9972957B1May 15, 2018
Connector module having insulated metal frame
IBM1 citations57
US11423577B2Aug 23, 2022
Printed circuit board assembly defect detection
IBM0 citations53
US11059120B2Jul 13, 2021
Non-destructive identifying of plating dissolution in soldered, plated through-hole
IBM0 citations52
US10590037B2Mar 17, 2020
Liquid immersion techniques for improved resistance to conductive anodic filament formation
IBM0 citations52
US10462900B2Oct 29, 2019
Glass fiber coatings for improved resistance to conductive anodic filament formation
IBM0 citations52
US10559522B2Feb 11, 2020
Integrated die paddle structures for bottom terminated components
IBM0 citations51
US10083894B2Sep 25, 2018
Integrated die paddle structures for bottom terminated components
IBM0 citations51
US9986649B2May 29, 2018
Increasing solder hole-fill in a printed circuit board assembly
IBM0 citations51
US9662732B2May 30, 2017
Increasing solder hole-fill in a printed circuit board assembly
IBM0 citations51
US9427828B2Aug 30, 2016
Increasing solder hole-fill in a printed circuit board assembly
IBM0 citations51
US9232664B2Jan 5, 2016
Heat transfer device for wave soldering
IBM0 citations51
US9148962B2Sep 29, 2015
Heat transfer device for wave soldering
IBM0 citations51
US9563739B2Feb 7, 2017
Technology for temperature sensitive components in thermal processing
IBM1 citations48
US9966719B1May 8, 2018
Connector module having insulated metal frame
IBM1 citations47
US10768245B2Sep 8, 2020
Compliant pin with self sensing deformation
IBM0 citations41