Inventor

HAN BYUNG J

US2 patents

⚠️ This page may combine multiple inventors who share the name “HAN BYUNG J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LUCENT TECHNOLOGIES INC

1 patent

US5608262AMar 4, 1997

Packaging multi-chip modules without wire-bond interconnection

LUCENT TECHNOLOGIES INC449 citations97

AT & T CORP

1 patent

US5473512ADec 5, 1995

Electronic device package having electronic device boonded, at a localized region thereof, to circuit board

AT & T CORP170 citations96