Inventor
TAKASE YOSHIHISA
JP9 patents
Patents
9 patentsUS6028011AFeb 22, 2000
Method of forming electric pad of semiconductor device and method of forming solder bump
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD115 citations95
US5208450AMay 4, 1993
IC card and a method for the manufacture of the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD98 citations93
US6347584B1Feb 19, 2002
Method of manufacturing electronic components using intaglio plate having dual releasing layers
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD21 citations92
US7151228B2Dec 19, 2006
Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD25 citations91
US7212094B2May 1, 2007
Inductive components and electronic devices using the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations83
US6753033B2Jun 22, 2004
Method of manufacturing ceramic thick-film printed circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD10 citations73
US6514364B2Feb 4, 2003
Manufacturing method of wiring board, and conductive paste used therein
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9 citations73
US7197820B2Apr 3, 2007
Circuit board and its manufacturing method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9 citations72
US6791818B1Sep 14, 2004
Electronic device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD9 citations72