Inventor

LIN QINGHUANG

US136 patents

⚠️ This page may combine multiple inventors who share the name “LIN QINGHUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN QINGHUANG

IBM

Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method

Patternable low dielectric constant materials and their use in ULSI interconnection

Patternable low dielectric constant materials and their use in ULSI interconnection

Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method

Resist composition and process of forming a patterned resist layer on a substrate

Encapsulation of magnetic tunnel junction structures in organic photopatternable dielectric material

Radiation sensitive silicon-containing resists

Molecular photoresists containing nonpolymeric silsesquioxanes

Spin-on antireflective coating for integration of patternable dielectric materials and interconnect structures

SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same

Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof

Radiation sensitive silicon-containing negative resists and use thereof

Method of forming a patterned organic dielectric layer on a substrate

Approach to formulating irradiation sensitive positive resists

Radiation sensitive silicon-containing resists

Neuro-stem cell stimulation and growth enhancement with implantable nanodevice

Encapsulation of magnetic tunnel junction structures in organic photopatternable dielectric material

Encapsulation of magnetic tunnel junction structures in organic photopatternable dielectric material

Methods for fabrication of an air gap-containing interconnect structure

Photopatternable dielectric materials for BEOL applications and methods for use

Photopatternable dielectric materials for BEOL applications and methods for use

SiCOH dielectric material with improved toughness and improved Si-C bonding

Surface treatment of inter-layer dielectric

Multiple patterning using patternable low-k dielectric materials

Adhesion enhancement for metal/dielectric interface

Spin torque MRAM fabrication using negative tone lithography and ion beam etching

Techniques for forming contacts for active BEOL

LIN QINGHUANG

Method for forming self-aligned airgap interconnect structures

Self-aligned permanent on-chip interconnect structures

Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication

Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating

Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication

CLEVENGER LAWRENCE A

Method for air gap interconnect integration using photo-patternable low k material

Methods for fabrication of an air gap-containing interconnect structure

BONILLA GRISELDA

Graphene cap for copper interconnect structures

Method of forming a graphene cap for copper interconnect structures

GLOBALFOUNDRIES INC

Self-aligned airgap interconnect structures

Method for fabricating a contact

LAM RES CORP

Integrated dry processes for patterning radiation photoresist patterning

Integrated dry processes for patterning radiation photoresist patterning

BOSTON SCIENT NEUROMODULATION CORP

Adaptive chronic pain relief via implanted electrical neurostimulation

Adaptive electrical neurostimulation treatment to reduce pain perception

CHEN SHYNG-TSONG

Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same

Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming same

INTERNAT BUSINESS MACHINES MAC

Irradiation sensitive positive-tone resists using polymers containing two acid sensitive protecting groups

FARMER DAMON BROOKS

High-speed graphene transistor and method of fabrication by patternable hard mask materials

SAMSUNG ELECTRONICS CO LTD

Method of forming a graphene cap for copper interconnect structures

EDELSTEIN DANIEL C

Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding

BRUCE ROBERT L

Interconnect structure and method for fabricating on-chip interconnect structures by image reversal

BROCK PHILLIP JOE

Photo-patternable dielectric materials curable to porous dielectric materials, formulations, precursors and methods of use thereof