Inventor
OKADA ISSEI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “OKADA ISSEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO ELECTRIC INDUSTRIES
14 patentsUS7445731B2Nov 4, 2008
Metallic colloidal solution and inkjet-use metallic ink
SUMITOMO ELECTRIC INDUSTRIES22 citations91
US7608203B2Oct 27, 2009
Metallic colloidal solution and inkjet-use metallic ink
SUMITOMO ELECTRIC INDUSTRIES10 citations82
US7691175B2Apr 6, 2010
Granular metal powder
SUMITOMO ELECTRIC INDUSTRIES6 citations62
US7510592B2Mar 31, 2009
Method of producing metal powder
SUMITOMO ELECTRIC INDUSTRIES2 citations62
US12538432B2Jan 27, 2026
Printed wiring board
SUMITOMO ELECTRIC INDUSTRIES0 citations60
US11013113B2May 18, 2021
Base material for printed circuit board and printed circuit board
SUMITOMO ELECTRIC INDUSTRIES0 citations60
US10610928B2Apr 7, 2020
Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material
SUMITOMO ELECTRIC INDUSTRIES1 citations60
US11752734B2Sep 12, 2023
Base material for printed circuit board and printed circuit board
SUMITOMO ELECTRIC INDUSTRIES0 citations59
US11465208B2Oct 11, 2022
Method of manufacturing copper nano-ink and copper nano-ink
SUMITOMO ELECTRIC INDUSTRIES0 citations53
US10307825B2Jun 4, 2019
Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder
SUMITOMO ELECTRIC INDUSTRIES0 citations51
US9967976B2May 8, 2018
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
SUMITOMO ELECTRIC INDUSTRIES0 citations51
US7285152B2Oct 23, 2007
Method of manufacturing chain-structure metal powder
SUMITOMO ELECTRIC INDUSTRIES0 citations51
US10796812B2Oct 6, 2020
Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer
SUMITOMO ELECTRIC INDUSTRIES0 citations50
US8026185B2Sep 27, 2011
Method for manufacturing electronic circuit component
SUMITOMO ELECTRIC INDUSTRIES0 citations41