Inventor
KAO KUO-SHU
TW15 patents
⚠️ This page may combine multiple inventors who share the name “KAO KUO-SHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
12 patentsUSD976852SJan 31, 2023
Power module
IND TECH RES INST8 citations83
US10490478B2Nov 26, 2019
Chip packaging and composite system board
IND TECH RES INST2 citations72
US10672677B2Jun 2, 2020
Semiconductor package structure
IND TECH RES INST2 citations70
US11776867B2Oct 3, 2023
Chip package
IND TECH RES INST0 citations61
US11387159B2Jul 12, 2022
Chip package
IND TECH RES INST0 citations61
US12381133B2Aug 5, 2025
Power semiconductor device
IND TECH RES INST0 citations58
USD1120892SMar 31, 2026
Power semiconductor module
IND TECH RES INST0 citations57
US12349293B2Jul 1, 2025
Combined power module
IND TECH RES INST0 citations57
USD1094288SSep 23, 2025
Power module
IND TECH RES INST0 citations56
US11114387B2Sep 7, 2021
Electronic packaging structure
IND TECH RES INST0 citations51
US9308603B2Apr 12, 2016
Solder, solder joint structure and method of forming solder joint structure
IND TECH RES INST0 citations51
US10622274B2Apr 14, 2020
Chip package
IND TECH RES INST0 citations50