Inventor
SUNAGA SEIJIRO
JP5 patents
Patents
5 patentsUS11167541B2Nov 9, 2021
Apparatus for manufacturing element array and apparatus for removing specific element
TDK CORP1 citations60
US11101317B2Aug 24, 2021
Method of manufacturing element array and method of removing specific element
TDK CORP0 citations60
US12406866B2Sep 2, 2025
Stamp tool, transfer device, and element array manufacturing method
TDK CORP0 citations59
US11541477B2Jan 3, 2023
Ultrasonic bonding device and ultrasonic bonding method
TDK CORP0 citations57
US11267071B2Mar 8, 2022
Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic bonding method
TDK CORP1 citations55