Inventor
MIYAGOSHI TOSHINOBU
JP11 patents
⚠️ This page may combine multiple inventors who share the name “MIYAGOSHI TOSHINOBU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
10 patentsUS6931717B2Aug 23, 2005
Apparatus for mounting an electronic part onto a circuit substrate
TDK CORP12 citations83
US7814645B2Oct 19, 2010
Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration
TDK CORP4 citations61
US11167541B2Nov 9, 2021
Apparatus for manufacturing element array and apparatus for removing specific element
TDK CORP1 citations60
US11101317B2Aug 24, 2021
Method of manufacturing element array and method of removing specific element
TDK CORP0 citations60
US7828190B2Nov 9, 2010
Ultrasonic mounting apparatus
TDK CORP6 citations60
US12406866B2Sep 2, 2025
Stamp tool, transfer device, and element array manufacturing method
TDK CORP0 citations59
US11541477B2Jan 3, 2023
Ultrasonic bonding device and ultrasonic bonding method
TDK CORP0 citations57
US11267071B2Mar 8, 2022
Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic bonding method
TDK CORP1 citations55
US7508115B2Mar 24, 2009
Horn, horn unit, and bonding apparatus using same
TDK CORP1 citations51
US7181833B2Feb 27, 2007
Method of mounting an electronic part
TDK CORP0 citations51