Inventor

JO CHAJEA

KR37 patents

⚠️ This page may combine multiple inventors who share the name “JO CHAJEA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JO CHAJEA

SAMSUNG ELECTRONICS CO LTD

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Through-silicon via structures including conductive protective layers

Semiconductor packages having through electrodes and methods for fabricating the same

Semiconductor package

Semiconductor package including a redistribution line

Semiconductor package

Semiconductor package

Semiconductor package

Semiconductor package

Semiconductor device

Semiconductor package

Semiconductor package

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor package with connection substrate and method of manufacturing the same

Semiconductor package including a redistribution line

Semiconductor package

Integrated circuit device and semiconductor package including the same

Semiconductor package including an image sensor chip and a method of fabricating the same

Semiconductor package

Integrated circuit device and semiconductor package including the same

Image sensor package with underfill and image sensor module including the same

Semiconductor package including an image sensor chip and a method of fabricating the same

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package and method of manufacturing the same

Semiconductor package

Semiconductor package and semiconductor device including the same

Semiconductor package and method of manufacturing the same

Memory device

Semiconductor devices having through-electrodes and methods for fabricating the same

JANG HYE-YOUNG

Semiconductor packages and methods for fabricating the same

RYU SEUNG KWAN

Semiconductor package and method of fabricating the same

JO CHAJEA

Semiconductor package and methods of manufacturing the same

SEO SUNKYOUNG

Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line

HEO JUNYEONG

Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same