Inventor
COFFIN JEFFREY T
US11 patents
⚠️ This page may combine multiple inventors who share the name “COFFIN JEFFREY T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS5990418ANov 23, 1999
Hermetic CBGA/CCGA structure with thermal paste cooling
IBM156 citations97
US5881944AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates
IBM53 citations96
US5881945AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates and process
IBM57 citations96
US6218629B1Apr 17, 2001
Module with metal-ion matrix induced dendrites for interconnection
IBM18 citations92
US5049201ASep 17, 1991
Method of inhibiting corrosion in an electronic package
IBM32 citations90
US6462271B2Oct 8, 2002
Capping structure for electronics package undergoing compressive socket actuation
IBM13 citations74
US7319591B2Jan 15, 2008
Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages
IBM7 citations73
US8037594B2Oct 18, 2011
Method of forming a flip-chip package
IBM2 citations62
US7489512B2Feb 10, 2009
Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packages
IBM2 citations62
US6584684B2Jul 1, 2003
Method for assembling a carrier and a semiconductor device
IBM3 citations62