Inventor

OGGIONI STEFANO S

IT70 patents

⚠️ This page may combine multiple inventors who share the name “OGGIONI STEFANO S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OGGIONI STEFANO S

IBM

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method of forming a land grid array interposer

Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method of producing a land grid array interposer structure

System for assembling electronic components of an electronic system

Electro-optical module comprising flexible connection cable and method of making the same

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

Tamper-respondent assembly with sensor connection adapter

Vented tamper-respondent assemblies

Circuit boards and electronic packages with embedded tamper-respondent sensor

Circuit boards and electronic packages with embedded tamper-respondent sensor

Discrete electronic device embedded in chip module

Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers

Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Electro-optical module comprising flexible connection cable and method of making the same

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Circuit boards and electronic packages with embedded tamper-respondent sensor

Circuit boards and electronic packages with embedded tamper-respondent sensor

Tamper-respondent assemblies with in situ vent structure(s)

Electronic devices with individual security circuits

Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section

Method of producing a land grid array (LGA) interposer structure

Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material

Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Photovoltaic module

HOUGHAM GARETH G

Method of forming a land grid array (LGA) interposer

Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer

Land grid array interposer producing method

Method of producing a land grid array interposer

Method of producing a land grid array (LGA) interposer structure

Method of producing a land grid array interposer

Method of producing a land grid array interposer utilizing metal-on-elastomer

OGGIONI STEFANO S

Multilayer securing structure and method thereof for the protection of cryptographic keys and code