Inventor

LI YONGGANG

US54 patents

⚠️ This page may combine multiple inventors who share the name “LI YONGGANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI YONGGANG

INTEL CORP

Method and core materials for semiconductor packaging

Pin grid array package substrate including pins having anchoring elements

Hybrid core through holes and vias

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

Method of providing solder bumps on a substrate using localized heating

Fabricating an RF filter on a semiconductor package using selective seeding

Multichip integration with through silicon via (TSV) die embedded in package

Panel with releasable core

Substrate embedded magnetic core inductors and method of making

Fabricating an RF filter on a semiconductor package using selective seeding

In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages

Substrate embedded magnetic core inductors and method of making

Multichip integration with through silicon via (TSV) die embedded in package

Method of enabling selective area plating on a substrate

Patternable die attach materials and processes for patterning

Die last and waveguide last architecture for silicon photonic packaging

Patternable die attach materials and processes for patterning

Microelectronic assemblies including interconnects with different solder materials

Electronic device package with reduced thickness variation

Electronic package that includes lamination layer

Optimization for raster scanning

Carrier chuck and methods of forming and using thereof

Thin electronic package elements using laser spallation

Process for forming a semiconductor device substrate

Conductive route patterning for electronic substrates

Die first fan-out architecture for electric and optical integration

Selective deposition of embedded thin-film resistors for semiconductor packaging

Selective metallization of an integrated circuit (IC) substrate

LI YONGGANG

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

Utilizing aperture with phase shift feature in forming microvias

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

Method of enabling selective area plating on a substrate

Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate

Method and core materials for semiconductor packaging

UNIV CENTRAL FLORIDA

Method of drawing a composite wire

Apparatus and method for drawing continuous fiber

Method of drawing a ceramic

HEFEI VISIONOX TECH CO LTD

Method and device for driving a display panel and display device

Driving method and driving device for a display panel, and display device

RAORANE DIGVIJAY A

Multichip integration with through silicon via (TSV) die embedded in package

ROY MIHIR K

Hybrid-core through holes and vias

BCHIR OMAR J

Substrates for optical die structures

ROY MIHIR

Coaxial plated through holes (PTH) for robust electrical performance

QUICK NATHANIEL R

Method for drawing continuous fiber

SMR PATENTS SARL

Automobile exterior rear view mirror blind spot warning indication device

GUZEK JOHN

Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP)

SALAMA ISLAM

Forming micro-vias using a two stage laser drilling process

NANJING BREADY ELECTRONICS CO LTD

Light guide film product processing apparatus

UNIV EAST CHINA SCIENCE & TECH

Sulfur-containing naphthalimide derivatives

SHARKNINJA OPERATING LLC

Steam cleaning apparatus