Inventor
SALAMA ISLAM
US20 patents
⚠️ This page may combine multiple inventors who share the name “SALAMA ISLAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS8372666B2Feb 12, 2013
Misalignment correction for embedded microelectronic die applications
INTEL CORP20 citations88
US8928151B2Jan 6, 2015
Hybrid core through holes and vias
INTEL CORP7 citations84
US10306760B2May 28, 2019
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
INTEL CORP6 citations83
US7998857B2Aug 16, 2011
Integrated circuit and process for fabricating thereof
INTEL CORP6 citations70
US7738257B2Jun 15, 2010
Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
INTEL CORP2 citations62
US7985622B2Jul 26, 2011
Method of forming collapse chip connection bumps on a semiconductor substrate
INTEL CORP3 citations61
US7831115B2Nov 9, 2010
Optical die structures and associated package substrates
INTEL CORP2 citations61
US7808797B2Oct 5, 2010
Microelectronic substrate including embedded components and spacer layer and method of forming same
INTEL CORP4 citations61
US8017022B2Sep 13, 2011
Selective electroless plating for electronic substrates
INTEL CORP1 citations51
US9266723B2Feb 23, 2016
Misalignment correction for embedded microelectronic die applications
INTEL CORP0 citations48
LI YONGGANG
5 patentsUS8440916B2May 14, 2013
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
LI YONGGANG17 citations91
US9648733B2May 9, 2017
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
LI YONGGANG3 citations72
US7891091B2Feb 22, 2011
Method of enabling selective area plating on a substrate
LI YONGGANG3 citations62
US8877565B2Nov 4, 2014
Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
LI YONGGANG0 citations41
US8183496B2May 22, 2012
Method of forming a pattern on a work piece, method of shaping a beam of electromagnetic radiation for use in said method, and aperture for shaping a beam of electromagnetic radiation
LI YONGGANG0 citations41