Inventor
LIE JAMES H
US8 patents
Patents
8 patentsUS6649832B1Nov 18, 2003
Apparatus and method for coupling with components in a surface mount package
CYPRESS SEMICONDUCTOR CORP27 citations92
US6592269B1Jul 15, 2003
Apparatus and method for integrating an optical transceiver with a surface mount package
CYPRESS SEMICONDUCTOR CORP41 citations92
US6734504B1May 11, 2004
Method of providing HBM protection with a decoupled HBM structure
CYPRESS SEMICONDUCTOR CORP15 citations83
US6880145B1Apr 12, 2005
Method for determining die placement based on global routing architecture
CYPRESS SEMICONDUCTOR CORP8 citations72
US6671868B1Dec 30, 2003
Method of creating MCM pinouts
CYPRESS SEMICONDUCTOR CORP8 citations71
US6683468B1Jan 27, 2004
Method and apparatus for coupling to a device packaged using a ball grid array
CYPRESS SEMICONDUCTOR CORP4 citations62
US6643833B1Nov 4, 2003
Method of localized placement manipulation without extra latency
CYPRESS SEMICONDUCTOR CORP3 citations60
US7010772B1Mar 7, 2006
Method and apparatus for generating superset pinout for devices with high-speed transceiver channels
CYPRESS SEMICONDUCTOR CORP0 citations50